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Views: 399 Author: Addams Publish Time: 2025-01-23 Origin: Site
1. Overview of QSFP-DD and OSFP
2. Advantages and differences between the two
Nowadays, we live, work, and study in all aspects. The rise of AI is inseparable from the computing power support of data centers, and computing power requires a high-speed communication network. At present, the industry-leading AI data centers all use 800G ultra-high-speed optical modules to provide the necessary communication network support for AI computing.
For 800G optical modules, there are now two mainstream packaging forms in the industry, QSFP-DD (Quad Small Form-factor Pluggable Double Density) and OSFP (Octal Small Form-factor Pluggable). These two packages have become the "new favorites" of the AI market due to their high bandwidth, high density, small size, low power consumption and low latency. Today, let's talk about the differences and advantages of these two packages.
QSFP-DD is a new generation of interface specifications developed based on the traditional QSFP (Quad Small Form-factor Pluggable) interface. Compared with the standard QSFP, the gold finger of QSFP-DD adds a row of contacts, provides an eight-channel electrical interface, can support a maximum transmission rate of 1.6Tbps, and has good backward compatibility, with a variety of combinations and matching modes, perfectly suitable for the existing Ethernet data center architecture, and can achieve lossless upgrade and expansion.
Like QSFP-DD, OSFP also supports 8 groups of high-speed electrical transceiver channels, and can provide a maximum transmission rate of 1.6Tbps (8x200G PAM-4). The difference is that OSFP is a new packaging specification independently launched in 2017 following the 400G optical module. At present, OSFP is mainly used in InfiniBand networks, but as most new AI data centers choose InfiniBand network architecture, OSFP packaging has become one of the most sought-after packaging specifications.
1. It adopts an 8-channel electrical interface with backward compatibility, and is compatible with QSFP packaging such as QSFP+/QSFP28/QSFP56, reducing port costs and equipment deployment costs.
2. It adopts 2×1 stacked integrated cages and connectors to reduce the footprint, and can put more modules in a 1U space, saving wiring and equipment costs.
3. The module can be equipped with heat sink fins to improve heat dissipation capacity and allow higher power output.
1. The OSFP module is designed as 8 channels and supports a total throughput of up to 1.6T, thereby achieving higher bandwidth density.
2. High support for InfiniBand network. The current communication network of AI computing power is basically based on the InfiniBand protocol.
3. The OSFP module has an integrated heat sink, which can greatly improve the heat dissipation performance and handle higher power consumption.
1. OSFP is not compatible with other optical interfaces and is an independent new interface, while QSFP-DD is the evolution of QSFP28 and is backward compatible with QSFP56/QSFP28.
2. QSFP-DD packaging is mainly used in traditional Ethernet data centers and runs the RoCE protocol. There are not many devices supporting the InfiniBand network, which is the mainstay of AI; OSFP is basically the main packaging form of InfiniBand network.
3. QSFP-DD is slightly smaller in size, OSFP is slightly larger in size, and has integrated heat sink fins, with a larger heat dissipation area and stronger heat dissipation capacity, which can support higher power applications.
Both packages can support 800G or higher rates, and there is no conclusion as to which is better. They are the result of the industry's pursuit of technological development and are the most suitable technical ideas for the moment. Technology is constantly improving, and perhaps in the future there will be new technologies with smaller size, lower power consumption and lower cost. Let us look forward to this day.
